| 摘要 |
A semiconductor chip package and a manufacturing method thereof are provided to prevent particles from being adhered on an active region formed on one surface of a semiconductor chip. An external electrode(22) is formed on a surface of a multi-layered ceramic substrate(21). A semiconductor chip(25) has an active region(26) and a bonding bump(27), and is flip-chip bonded to the substrate so that the bonding bump is connected to the external electrode on the ceramic substrate. A resin sheet layer(24) is formed between the ceramic substrate and the semiconductor chip to seal a bonding bump connected to the external electrode and the active region. The active region of the semiconductor chip is formed on a center portion, and the bonding bump is formed on an edge of the active region.
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