| 摘要 |
<p>The present invention is about a composition for high performance printed circuit board. Said composition includes 20-35 wt% of high molecular polymer of high molecular weight of polybutadiene with high vinyl groups, low molecular weight of polybutadiene and cyclic olefin polymer with two or above vinyl groups, and/or thermosetting polymer resin which was polymerized from acrylic acid, acrylonitrile and butadiene; 10-30 wt% woven glass fiber reinforced cloth; 25-50 wt% inorganic particulate filler; 1-10 wt% metallic coagents; 10-30 wt% brominated flame retardant. Using solvents to dilute the composition to the suitable viscosity, then after the resin sheet (prepreg) had been made by impregnation, the electric circuit board composition with excellent properties can be obtained by laminating at 170-220°C with 20-50 kg/cm 2 .</p> |
