CHIP STACKING PACKAGES AND METHOD OF MANUFACTURING THE SAME

摘要

A chip stack package and a manufacturing method thereof are provided to improve the yield of a first chip since it is not necessary to increase the size of the first chip form formation of plugs. A chip stack package includes an intermediate substrate(110) having a recess(112), a first chip(130) mounted in the recess, and a second chip(140) disposed on the intermediate substrate, the second chip being electrically connected to the first chip. A package substrate(150) is disposed under the intermediate substrate, and plugs(120) penetrate the intermediate substrate to electrically connect the second chip with the package substrate. The recess is disposed at a lower portion of the intermediate substrate, and the first and second chips are electrically connected to each other through second plugs.