| 摘要 |
A probe card includes a plurality of probes (2) that contacts a plurality of electrodes provided in the semiconductor wafer and that inputs or outputs an electrical signal in or from the electrodes, a probe head (3) that holds the probes, a substrate (4) having a wiring which is provided near the surface of the substrate facing the probe head so as to be contactable with the probe head and is connected to the probes, a core layer (6) formed of a material which is buried in the substrate and has a coefficient of thermal expansion lower than that of the substrate, and a connecting member (42) that electrically connects at least some of the probes with an external device via the wiring.
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