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发明名称
Mems package
摘要
The present invention provides a MEMS package, the MEMS package comprising a substrate which comprises a recess, and a MEMS device, situated in the recess.
申请公布号
GB0807926(D0)
申请公布日期
2008.06.11
申请号
GB20080007926
申请日期
2008.04.30
申请人
WOLFSON MICROELECTRONICS PLC
发明人
分类号
主分类号
代理机构
代理人
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