PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE HAVING THE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

摘要

A printed circuit board, a method for manufacturing the printed circuit board, a semiconductor package having the printed circuit board, and a method for manufacturing the semiconductor package are provided to reduce a laminated height of the semiconductor package by inserting a conductive connection member into a substrate. A first substrate(11) has an accommodating unit(14). A conductive connection member(12) is provided in the accommodating unit. A bonding member(13) is provided in the accommodating unit to encapsulate it. A second substrate is coupled to the first substrate through the bonding member. The second substrate is electrically connected to the first substrate through the conductive connection member. The conductive connection member includes a solder paste. The bonding member includes a polymer film having adhesive property. The bonding member includes an anisotropic conduction film.