| 摘要 |
<p>A semiconductor device package and a manufacturing method thereof are provided to facilitate a manufacturing process of the semiconductor device by implementing semiconductor devices without using bumps. A wiring substrate includes a base film(200), a first wiring pattern(208), a second wiring pattern(214), a coupling metal layer(215), and an insulation layer(216). The first wiring pattern contains copper. The second wiring pattern is arranged on the first wiring pattern at a non-implementation region. The coupling metal layer is arranged on the first and second wiring patterns. The insulation layer is arranged on the non-implementation region. A semiconductor device(110) has an active surface, a rear substrate, and a side surface. The rear surface is opposed to the active surface. An insulation resin(230) is arranged between the wiring substrate and the semiconductor device and at the side surface of the semiconductor device.</p> |
