发明名称 WAFER-PAIR HAVING DEPOSITED LAYER SEALED CHAMBERS
摘要 A wafer-pair having at least one recess in one wafer forms at least one chamber with the attaching of the other wafer which has at least one port which is plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the seal ed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, and may be divided into chips.
申请公布号 CA2326455(C) 申请公布日期 2008.06.10
申请号 CA19992326455 申请日期 1999.03.29
申请人 HONEYWELL INC. 发明人 HIGASHI, ROBERT E.;WOOD, R., ANDREW;RIDLEY, JEFFREY A.
分类号 H01L23/10;H01L29/84;B81B7/00;H01L23/02;H01L25/16;H01L33/00 主分类号 H01L23/10
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