发明名称 METHOD OF MEASURING STRUCTURE PARAMETERS METALLIC-SEMICONUCTOR FILM OR INSULATING SUBSTRATE
摘要 FIELD: thin films technology and multi-layer nano-structures. ^ SUBSTANCE: "metallic film - semiconductor or insulating substrate" structure is exposed to microwave radiation using a wave guide system. In front of the structure there is a dielectric plate with thickness L, and dielectric coefficient epsid, for which, in the chosen frequency range on one of the frequencies omega1, the condition holds, and on another frequency omega2, the condition holds, where a is the typical size of the cross-section of the wave guide system, omega=2pif is the angular frequency of the radiation, and epsi0 and mu0 are the dielectric and magnetic permittivity in a vacuum, respectively. Relative dielectric permittivity of the chosen dielectric plate should be more than 2. Electro-conductivity or thickness of the metallic film is determined from the frequency response of the reflection coefficient of the structure. ^ EFFECT: broader range of the measured thickness and class of the analysed materials and increased sensitivity. ^ 2 cl, 6 dwg
申请公布号 RU2326368(C1) 申请公布日期 2008.06.10
申请号 RU20060144142 申请日期 2006.12.14
申请人 GOU VPO "SARATOVSKIJ GOSUDARSTVENNYJ UNIVERSITET IMENI N.G. CHERNYSHEVSKOGO" 发明人 USANOV DMITRIJ ALEKSANDROVICH;SKRIPAL' ALEKSANDR VLADIMIROVICH;ABRAMOV ANTON VALER'EVICH;BOGOLJUBOV ANTON SERGEEVICH
分类号 G01N22/00;G01B15/02 主分类号 G01N22/00
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