发明名称 Die for forming honeycomb structure, and method of manufacturing the same
摘要 There is disclosed a die 1 for forming a honeycomb structure comprises: a plate-like die substrate 2 having at least two surfaces 8, 9 , in which back holes 3 for introducing a green material are formed in one surface 8 , and slits 4 communicating with back holes 3 are formed in the other surface 9 ; an underlayer 5 disposed on the substrate 2 so as to coat at least a part of a portion constituting the back hole 3 and the slit 4 ; an intermediate layer 6 disposed so as to coat at least a part of the underlayer 5 and constituted of tungsten carbide particles whose average particle diameter is 5 mum or less and containing W<SUB>3</SUB>C as a main component; and a surface layer 7 disposed so as to coat at least a part of the intermediate layer 6 and constituted of diamond and/or diamond-like carbon.
申请公布号 US7384258(B2) 申请公布日期 2008.06.10
申请号 US20050174657 申请日期 2005.07.06
申请人 NGK INSULATORS, LTD. 发明人 KUWAHARA HIROSHI;MATSUOKA SUSUMU;SAITO TAKAO
分类号 B29C47/12 主分类号 B29C47/12
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