| 摘要 |
An electronic device to be loaded on an electronic equipment or an electronic component is mounted on a mount substrate, the mount substrate being made thin and flexible and having strong resistance to bending. An electronic device package including: a flexible substrate having a wiring pattern formed thereon; and an electronic device having a terminal formation face on which a connection terminal is provided, wherein the connection terminal is electrically connected directly or via a conductive member to the wiring pattern, and the terminal formation face is substantially aligned in a neutral plane of bending in a thickness direction of the electronic device package.
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