发明名称 Hybrid orientation SOI substrates, and method for forming the same
摘要 The present invention relates to a hybrid orientation semiconductor-on-insulator (SOI) substrate structure that contains a base semiconductor substrate with one or more first device regions and one or more second device regions located over the base semiconductor substrate. The one or more first device regions include an insulator layer with a first semiconductor device layer located atop. The one or more second device regions include a counter-doped semiconductor layer with a second semiconductor device layer located atop. The first and the second semiconductor device layers have different crystallographic orientations. Preferably, the first (or the second) device regions are n-FET device regions, and the first semiconductor device layer has a crystallographic orientation that enhances electron mobility, while the second (or the first) device regions are p-FET device regions, and the second semiconductor device layer has a different surface crystallographic orientation that enhances hole mobility.
申请公布号 US7385257(B2) 申请公布日期 2008.06.10
申请号 US20060411280 申请日期 2006.04.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 IEONG MEIKEI;WANG XINLIN;YANG MIN
分类号 H01L29/76 主分类号 H01L29/76
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