| 摘要 |
A structure of protection of a first area of a semiconductor wafer including a substrate of a first conductivity type against high-frequency noise likely to be injected from components formed in the upper portion of a second area of the wafer, includes a very heavily-doped wall of the first conductivity type having substantially the depth of the upper portion. The wall is divided into three heavily-doped strips of the first conductivity type separated and surrounded by medium-doped intermediary strips of the first conductivity type. The distance between the heavily-doped strips being of the order of magnitude of the substrate thickness.
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