| 摘要 |
A light emitting diode module and a method for manufacturing the same are provided to maximize the optical efficiency of a light source by forming a reflective layer with a metal having a high reflectivity. A metal plate(121) having an upper conductive layer, or an insulating plate with upper and lower conductive layers is prepared. A pad(123a) is formed by patterning the upper conductive layer according to a preset pattern circuit. A resist(124) is coated on a region except the pad. A reflective layer(125) is coated on an upper surface of the resist corresponding to the remaining region except the surroundings of the pad. A light emitting source is electrically mounted on the pad which is exposed to the outside through the reflective layer. The reflective layer is made of aluminum, silver, and an alloy thereof through deposition, sputtering, or plating. The reflective layer coating process is performed after a pad protective member is attached on the pad.
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