| 摘要 |
A dicing adhesive film is provided to sufficiently cover a bonding wire over a semiconductor chip by effectively insulating the bonding wire from the semiconductor chip. A dicing adhesive film includes first and second layers(5,6). The first layer includes a first epoxy resin, a first reactive resin, a first epoxy curing agent, and a first heat igniter. The first reactive resin has at least two carbon double bonds. A half period of the first heat igniter is shorter than 0.1 hour at 80 °C. The second layer includes a second epoxy resin, a second reactive resin, a second epoxy curing agent, and a second heat igniter. The first second resin has at least two carbon double bonds. A half period of the second heat igniter is longer than 0.5 hour at 160 °C. The second layer is laminated under the first layer. |
