| 发明名称 |
Electronic packaging using conductive interproser connector |
| 摘要 |
Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.
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| 申请公布号 |
US7385288(B2) |
申请公布日期 |
2008.06.10 |
| 申请号 |
US20070761315 |
申请日期 |
2007.06.11 |
| 申请人 |
INTEL CORPORATION |
发明人 |
BOGGS DAVID W.;DUNGAN JOHN H.;SANDERS FRANK A.;SATO DARYL A.;WILLIS DAN |
| 分类号 |
H01L23/48;H01L21/48;H01L23/14;H01L23/52;H01L29/40;H01R13/24;H05K3/32;H05K7/10 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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