发明名称 Multi-level printed circuit board interstitial vias
摘要 A printed circuit board having interstitial vias. The printed circuit board has a plurality of overlying electrical conductors disposed within an inner region of the printed circuit board. The overlying electrical conductors are separated by dielectric material. The printed circuit board has an aperture passing through a portion of the plurality of overlying electrical conductors printed circuit board. The overlying electrical conductors have ends with recesses therein. An electrical conductive via passes through the aperture with distal portions of the via projecting into the recesses.
申请公布号 US7385472(B1) 申请公布日期 2008.06.10
申请号 US20060427208 申请日期 2006.06.28
申请人 EMC CORPORATION 发明人 DOWNES STUART D.
分类号 H01F5/00 主分类号 H01F5/00
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