| 摘要 |
The present invention provides a method for implanting charged particles in a substrate and a method for manufacturing an integrated circuit. The method for implanting charged particles in a substrate, among other steps, includes projecting a beam of charged particles ( 320 ) to a substrate ( 330 ), the beam of charged particles ( 320 ) having a given beam divergence, and forming a diverged beam of charged particles ( 360 ) by subjecting the beam of charged particles ( 320 ) to an energy field ( 350 ), thereby causing the beam of charged particles ( 320 ) to have a larger beam divergence. The method then desires implanting the diverged beam of charged particles ( 360 ) into the substrate ( 330 ).
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