发明名称 HIGH DENSITY SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>A highly-integrated semiconductor memory device and a manufacturing method thereof are provided to correctly read data by suppressing a leakage current generated as the semiconductor memory device is highly integrated. A source/drain electrode(220A) are formed on a silicon substrate to form a schottky junction with a channel region(220B). A floating gate composed of plural silicon nanodots(260A) is formed on the substrate of the channel region. The silicon nanodot is made of a silicon compound as a basal body, and a gate dielectric layer(270) is formed on the floating gate. A tunneling dielectric layer(250) is formed between the substrate of the channel region and the floating gate, and a control gate(280) is formed on the floating gate.</p>
申请公布号 KR20080051010(A) 申请公布日期 2008.06.10
申请号 KR20070094687 申请日期 2007.09.18
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 KIM, TAE YOUB;JUN, MYUNG SIM;KIM, YARK YEON;JANG, MOON GYU;CHOI, CHEL JONG;LEE, SEONG JAE;PARK, BYOUNG CHUL
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
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