发明名称 |
A WAFER PREVENTING FILM IN WAFER PACKING JAR |
摘要 |
A wafer protecting film in a wafer packaging container is provided to prevent impact and the generation of a surface scratch during a wafer transfer by using an absorption film for absorbing moisture and contaminants. A wafer protecting film(30) is a wafer insert which is arranged between wafers for protecting a surface of the wafer from contamination and rubbing between the wafers. The wafer protecting film is comprised of an upper film(32), a lower film(34), and an absorption film(36). The upper film, the lower film, and the absorption film are thermally treated at a high temperature and cemented at each edge thereof to configure the wafer protecting film. The absorption film is disposed between the upper film and the lower film. The absorption film includes an activated carbon as an absorbent for eliminating contaminants. Therefore, the wafer protecting film effectively eliminates the contaminants from the outside and/or contaminants generated in a wafer packaging container.
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申请公布号 |
KR20080050703(A) |
申请公布日期 |
2008.06.10 |
申请号 |
KR20060121266 |
申请日期 |
2006.12.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
OH, HYEONG SEOB;KIM, HYEOG KI;KIM, KI DOO;LEE, MIN SEON;KANG, JIN YOUNG;BACK, SEUNG HEE |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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