| 摘要 |
An electroplating device is provided to allow a partial plating process to be selectively performed on one face of front and rear faces of a band type plating object, or on one of upper, middle and lower portions of the one face, and to carry out electroplating sequentially while transferring the plating object in a state that the band type plating object is closely adhered to a cover body of the electroplating device. An electroplating device comprises: a drum(100) for supplying an electrolyte as an arc-shaped close adhesion face; a positive voltage supply body(200) which is connected to a front portion of the drum, and which allows the electrolyte to maintain a positive polarity; a cover body(300) for enabling the electrolyte to make contact with a surface of a plating object(10) guided along a guide groove(320) in a state that the positive voltage supply body is covered with the cover body; and a negative voltage supply body which is formed to apply a negative voltage to the drum while guiding the plating object that is closely adhered to the cover body in a state that the negative voltage supply body is axially connected to both sides of the drum. The drum has an arc-shaped close adhesion face(120) formed on a front face thereof, a storage tank(140) formed therein to store the electrolyte, and electrolyte supply ports(160) formed from the storage tank and spaced from one another in an equal distance along the close adhesion face. The supply ports have electrolyte filling parts(180) formed at the lower side thereof along the close adhesion face in a state that the supply ports are formed above the close adhesion face. The electroplating device further comprises an electrolyte supply pipe(500) connected to an upper side of the drum through the storage tank.
|
