ELECTRONIC COMPONENT, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a thinned, reliable electronic component formed by a semiconductor substrate.

SOLUTION: A method of manufacturing the electronic component includes: a process for forming via holes penetrating through a first semiconductor substrate and a second semiconductor substrate which are bonded together by way of a connection layer; a process for pattern-etching the second semiconductor substrate with the connection layer as an etching stop layer to form trenches communicating with the via holes; and a process for integrally forming via plugs buried in the via holes and pattern wiring buried in the trenches by plating.

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