| 发明名称 |
Injection Molding Process, Apparatus and Material for Forming Cured-In-Place Gaskets |
| 摘要 |
The present invention relates to a process for forming a cured-in-place gasket by liquid injection molding. More particularly, the present invention relates to a low pressure and room temperature process for forming a cured-in-place gasket by liquid injection molding.
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| 申请公布号 |
US2008128955(A1) |
申请公布日期 |
2008.06.05 |
| 申请号 |
US20060814590 |
申请日期 |
2006.02.08 |
| 申请人 |
HENKEL CORPORATION |
发明人 |
LIM THOMAS FAY-OY;CROSS ROBERT P.;CHU HSIEN-KUN;DUCH DEBORAL E.;LIISTRO MATHIAS E.;DECATO ALFRED A.;HORELIK ANTHONY R.;LIOBERBER JAMES E. |
| 分类号 |
H05B6/00;B29D99/00 |
主分类号 |
H05B6/00 |
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