发明名称 SURFACE TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent leaking of electric current to the outside of an electrode unit transmitted through a cooling medium in a plasma surface treatment device. <P>SOLUTION: A high voltage side cooling path 24 is formed inside a high voltage electrode 11 of an electrode unit 11 of the plasma surface treatment device. A ground side cooling outgoing path 22 and a ground side cooling return path 26 are formed inside the ground electrode 12. One end of the ground side cooling outgoing path 22 is connected to a cooling medium supply path 2a at the outside of the electrode unit 10, and the other end is connected to one end of the high voltage side cooling path 24 through a communicating outgoing path 23 of a holder 13. One end of the ground side cooling return path 26 is connected to the other end of the high voltage side cooling path 24 through a communication return path 25 of the holder 13 and the other end is connected to an exhaust path 2b at the outside of the electrode unit 10. The cooling medium inside the ground side cooling outgoing path 22 and the return path 26 is grounded electrically through the ground electrode 12. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008130270(A) 申请公布日期 2008.06.05
申请号 JP20060311301 申请日期 2006.11.17
申请人 SEKISUI CHEM CO LTD 发明人 IWASAKI MASAKI
分类号 H05H1/24;C23C16/50;H01L21/304;H01L21/3065 主分类号 H05H1/24
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