发明名称 POSITIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition improved in exposure latitude, pattern collapse and performance difference between a dense pattern and an isolated pattern, even in the formation of a fine pattern of 100 nm or smaller, and to provide a pattern forming method that uses the composition. <P>SOLUTION: The positive photosensitive composition comprises (A) a resin which is decomposed by the action of an acid to increase solubility in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and (C) a non-polymer compound which is decomposed by the action of an acid to increase solubility in an alkali developer, wherein a group released by the decomposition due to the action of the acid has a hydroxyl group or an ether bond. The pattern-forming method that uses the composition is also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008129343(A) 申请公布日期 2008.06.05
申请号 JP20060314466 申请日期 2006.11.21
申请人 FUJIFILM CORP 发明人 SAEGUSA HIROSHI
分类号 G03F7/039;G03F7/004;H01L21/027 主分类号 G03F7/039
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