发明名称 ADHESIVE COMPOSITION AND ADHESIVE FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition being excellent in heat resistance, adhesive strength under high temperature conditions and alkali resistance and easy in peeling after a high temperature process. <P>SOLUTION: The adhesive composition is composed mainly of a polymer prepared by the copolymerization of a monomer composition comprising styrene, a (meth)acrylate having a cyclic structure and an alkyl (meth)acrylate having a chain structure. And the monomer composition may further contain a carboxylic acid having an ethylenic double bond, a bifunctional monomer and a styrene macromonomer, and, when the polymer contains a styrene block segment, heat resistance, adhesive strength in high temperature conditions, alkali resistance and easiness of peeling after a high temperature process are enhanced. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008127506(A) 申请公布日期 2008.06.05
申请号 JP20060316094 申请日期 2006.11.22
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ASAI TAKAHIRO;MISUMI KOICHI;MIYANARI ATSUSHI;INAO YOSHIHIRO;NAKAMURA AKIHIKO
分类号 C09J153/00;C08F290/04;C09J7/02;C09J155/00 主分类号 C09J153/00
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