| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder-mounted printed circuit board capable of improving solder wicking performance by suppressing heat dissipation to a solid pattern, and ensuring the uniformity of the temperature of the printed circuit board as a whole. SOLUTION: In the printed circuit board in which a through-hole 2 is formed on a solid pattern 1, and a land 3 is formed at the periphery of the through-hole 2, a thermal land 4 is formed at a part of the outer circumference of the island 3, and a through-hole 5 is formed at the joint between the thermal island 4 and the solid pattern 1. COPYRIGHT: (C)2008,JPO&INPIT
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