发明名称 TREATMENT CONDITION DETERMINATION METHOD AND THIN FILM FORMATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a treatment condition determination method, by which treatment conditions for forming a thin film of a desired thickness is determined. SOLUTION: When determining the treatment conditions exhibiting a relation between the processing time of a thin film formation treatment and the thickness of the thin film formed by the thin film formation treatment, the treatment conditions are determined by measuring the thickness Ta (thickness z13) of the thin film formed by conducting the thin film formation treatment, wherein the processing time is defined as L sec (e.g. time point t0-t11) for Na times (e.g. 3 times), measuring the thickness Tb (thickness z23) of the thin film formed by conducting the thin film formation treatment, wherein the processing time is defined as M sec (e.g. time point t0-t21) for Nb times (e.g. 3 times), defining the thickness as Ta/Na (thickness z11) of the thin film formed by the thin film formation treatment, wherein the processing time is defined as L sec, and defining the thickness as Tb/Nb (thickness z21) of the thin film formed by the thin film formation treatment, wherein the processing time is defined as M sec. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008127683(A) 申请公布日期 2008.06.05
申请号 JP20070194033 申请日期 2007.07.26
申请人 TDK CORP 发明人 YANAGISAWA TAKUMI;SASAKI TETSUO;MIURA SATOSHI
分类号 C23C14/34 主分类号 C23C14/34
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