发明名称 SURFACE TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a surface treating apparatus capable of treating an object larger than conventional one and applying a surface treatment as being expected even to such a larger object. SOLUTION: The surface treating apparatus is equipped with a straight linear filament 40 for emitting thermions and an anode 42 for generating plasma by accelerating the thermions to collide with gaseous particles. The filament 40 generates thermal expansion by being positively heated. However, but the filament 40 is not deformed even when it thermally expands since it is given a tensile force by a movable supporting part 200 (a tensile force imparting mechanism 210) supporting its one end. Accordingly, the plasma generated between the filament 40 and the anode 42 is stabilized. The apparatus can flexibly deal with objects having various dimensions by appropriately setting the length dimension of the filament 40. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008127670(A) 申请公布日期 2008.06.05
申请号 JP20060317136 申请日期 2006.11.24
申请人 SHINKO SEIKI CO LTD 发明人 KOMATSU EIJI;NOMA MASAO
分类号 C23C14/32 主分类号 C23C14/32
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