| 摘要 |
PROBLEM TO BE SOLVED: To manufacture with a high speed a micro fluid chip that is free from damages by heating due to the welding and is high in shape retention. SOLUTION: The method comprises making a resin-made plate-like lid stick closely to the top face of a resin-made, groove-carrying substrate that has a groove of an untrafine size (μm size) formed on its top face, setting the substrate and the lid stuck closely in a press apparatus consisting of an upper mold that is transparent and has a heat sink function and a lower mold and performing the mold clamping, arranging on the upper face of the upper mold a mask corresponding to the groove, and irradiating IR from the upper mold side to weld the substrate and the lid. COPYRIGHT: (C)2008,JPO&INPIT
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