SEMICONDUCTOR DEVICE WITH LEADFRAME FINGER LOCK

摘要

In a method and system for fabricating a semiconductor device (200), a portion of a metal sheet to form a leadframe (210) having a lead finger (220) is removed to form a lead finger lock (260). The lead finger lock is disposed within a configurable distance of a wirebonding joint (240) located on a surface of the lead finger. An integrated circuit (integrated circuit) chip (290) is attached to the leadframe. A conductive pad end (232) of a bond wire (230) is bonded to the integrated circuit chip and a lead finger end (234) of the bond wire is bonded to an inner end (222) of the lead finger at the wirebonding joint. The integrated circuit chip, the leadframe, the lead finger, and the wirebonding are encapsulated with a molding compound (molding compound) (250). The lead finger lock that is encapsulated by the molding compound limits a relative displacement between the molding compound and the lead finger at the wirebonding joint.