| 摘要 |
<p>Semiconductor manufacture equipment having a wafer transfer robot and a method for controlling the same are provided to reduce a transfer time required for a wafer transfer by varying a transfer speed of the wafer transfer robot. It is determined whether there is a wafer to be transferred to a transfer robot corresponding to a treatment process of a process recipe(S350). In case there is a wafer to be transferred to the transfer robot, the transfer robot is controlled by a first speed(S360). Otherwise, if there is no wafer to be transferred to the transfer robot, the transfer robot is controlled by a second speed faster than the first speed(S380). The speed of the transfer robot is controlled by a controller. Therefore, the controller varies the speed of the transfer robot to reduce a transfer time required for a wafer transfer.</p> |
