| 摘要 |
An in-line auto COG(Chip On Glass) bonding apparatus is provided to reduce a bonding process time by automating an ACF process and a COG bonding process. A loader(1) loads an LCD panel. An ACF(Anisotropic Conductive Film) bonding unit(3) attaches and inspects an anisotropic conductive film on a glass loaded on the loader. A pre-bonding unit(5) mounts a semiconductor chip on the glass including the ACF by using a rotary method and identifies patterns and positions of the semiconductor chip and the glass. A main bonding unit(7) mounts the semiconductor chip on the glass. An unloader(9) discharges the glass by using a conveyer method. A plurality of transfers(13) are arranged among the loader, the ACF bonding unit, the pre-bonding unit, the main bonding unit, and the unloader in order to transfer the glass. A control unit(11) controls the loader, the ACF bonding unit, the pre-bonding unit, the main bonding unit, and the unloader.
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