| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a coupling structure between an LED and a liquid phase/gas phase heat dissipation device for giving a good heat dissipation effect for heat energy generated from the LED. <P>SOLUTION: The coupling structure includes a metal housing 12, a liquid phase/gas phase heat dissipation device 11, having a specific amount of liquid and a capillary structure therein, an LED unit 21 disposed on the surface of the metal housing 12 having at least an LED chip 22, a lead wire 24, an insulation plate 26, an electrode piece 28, and a resin mould 29. The LED chip 22 is disposed on the surface of the metal housing 12, connected to the metal housing 12. An insulation plate 26 is disposed on the surface of the metal housing 12; an electrode piece 28 is arranged on the insulation plate 26; the lead wire 24 is connected to the LED chip 22 and the electrode piece 28, respectively with the both ends thereof; and not only does the resin mould 29 cover the lead wire 24 and the LED chip 22, but also covers a portion of the insulation plate 26 and the electrode piece 28. <P>COPYRIGHT: (C)2008,JPO&INPIT |
