| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a manufacturing method capable of easily forming a capacitor insulating layer and an interlayer insulating layer with a low dielectric constant only in respectively required places concerning the method for manufacturing a capacitor incorporating multilayer printed wiring board incorporating a capacitor composed of a lower electrode and an upper electrode. <P>SOLUTION: The capacitor incorporating multilayer printed wiring board manufacturing method includes the processes (A)-(E): (A) a process for forming the lower electrode 13 on a base material; (B) a process for selectively forming the capacitor insulating layer 17, composed of a high dielectric constant material, on the lower electrode 13; (C) a process for selectively forming a second insulating layer 21, composed of a low dielectric constant material, on a part other than the capacitor insulating layer 17 in the base material; (D) a process for polishing the surfaces of the capacitor insulating layer 17 and the second insulating layer 21; and (E) a process for forming the upper electrode 25 on the capacitor insulating layer 17 in response to the lower electrode. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
