发明名称 ELECTRONIC PART BUILT-IN MULTILAYER BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a highly versatile electronic part built-in multilayer board that can easily cope with even a case where an external circuit to be connected is different. <P>SOLUTION: A connector 4 has a plurality of connecting wires to be connected to each of first sensor 1 to third sensor 3. Among electronic part groups 10a-10c, 11a-11c, and 12a-12c to be connected to the connecting wires, the electronic parts 10a, 11a, and 12a connected directly from the connector 4 are mounted onto either of front and rear surfaces of the multilayer board. Therefore, even if a sensor to be connected is changed to one with different characteristics, an electronic part mounted to the front surface or the rear surface can be changed according to the changed sensor, thus coping with the change of sensor. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008130612(A) 申请公布日期 2008.06.05
申请号 JP20060310578 申请日期 2006.11.16
申请人 DENSO CORP 发明人 ITO MASARU;ITABASHI TORU
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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