| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Fe-P-based copper alloy sheet which has both of high strength and an oxide film superior in adhesiveness. SOLUTION: The Cu-Fe-P-based copper alloy sheet has such enhanced strength as a tensile strength of 500 MPa or higher and a hardness of 150 Hv or higher even though containing a comparatively small amount of Fe, and has a kurtosis (peakedness degree) Rku of a roughness curve obtained through surface roughness measurement in conformance with JIS B0601 controlled to 5.0 or less by cleaning treatment involving etching or the like. Then, the copper alloy sheet acquires an improved adhesiveness of the oxide film and enhances the reliability of a semiconductor package. COPYRIGHT: (C)2008,JPO&INPIT |
