| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicon wafer backside inspection device for realizing a high inspection precision, reproducibility and the reduction of inspection time with high inspection speed by solving the problem of a conventional silicon wafer inspection device using an area sensor camera that needs to inspect by dividing the wafer into a plurality of small regions from the limitation of the resolution of the area sensor, while inspection accuracy is low and inspection time is long. SOLUTION: The wafer backside inspection device includes an imaging system having a line sensor as an imaging element, an illuminating system for illuminating as a dark field illumination the imaging portion of the wafer backside, a moving system for relatively moving in a predetermined direction between the imaging system and the illumination system, and a wafer rotation system for rotating the wafer with the almost circular center of the wafer as a rotation center. A high contrast defect image is obtained by the dark field illumination, while the defect is observed without relating to the defect direction by having scanning images in different two directions of the wafer. COPYRIGHT: (C)2008,JPO&INPIT
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