| 摘要 |
PROBLEM TO BE SOLVED: To provide a board device with which misalignment of terminal groups at the time of thermocompression bonding of TCPs (Tape Carrier Packages) is suppressed. SOLUTION: Before thermocompression bonding the TCPs 16a and 16b, the pitch between a terminal group 26 on the substrate side positioned at the outermost end and an adjacent terminal group 26 on the substrate side is set smaller than predetermined pitches P1 and P2 when the TCPs 16a and 16b are thermocompression bonded. Misalignment between a terminal groups 24a and 24b on the second tape side and the terminal groups 26a and 26b on the substrate side due to stretch of substrate bodies 17a and 18a of PCB 17 and 18 at the time of thermocompression bonding of the TCPs 16a and 16b can be suppressed. COPYRIGHT: (C)2008,JPO&INPIT
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