发明名称 GROUNDING MEMBER AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a grounding member capable of improving connection strength to a grounding conductor. SOLUTION: The grounding member 20 is connected to a grounding conductor (shield layer 13) by using a conductive connection agent 30. A connection surface to the grounding conductor (shield layer 13) in the grounding member 20 has surface roughness Ra not smaller than 0.09μm. In order to obtain the surface roughness, a blast treatment or a mat plating treatment is suitable. By setting the connection surface to the grounding conductor (shield layer 13) in the grounding member 20 at predetermined surface roughness, friction resistance to the grounding conductor (shield layer 13) can be increased, and connection strength to the grounding conductor (shield layer 13) can be enhanced. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008130299(A) 申请公布日期 2008.06.05
申请号 JP20060312237 申请日期 2006.11.17
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KOBAYASHI MOTOO;KOYAMA KEIJI
分类号 H01R9/05 主分类号 H01R9/05
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