| 摘要 |
A method is described for mounting semiconductor chips and a corresponding semiconductor chip system. The method may include providing a semiconductor chip having a surface that includes a diaphragm region and a peripheral region, the peripheral region having a mounting region, and a cavity being disposed underneath the diaphragm region, which extends into the mounting region and ends there in an opening. The method may also include providing a substrate which has a surface having a recess; mounting the mounting region of the semiconductor chip in flip-chip technology onto the surface of the substrate in such a way that an edge of the recess lies between the mounting region and the diaphragm region and the opening faces in the direction of the substrate. Additionally, the mounting region is underfilled using an underfilling, the edge of the recess serving as separating region for the underfilling so that no underfilling reaches the diaphragm region; and a through hole is provided through the substrate to the opening of the cavity.
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