发明名称 |
Herstellungsverfahren für einen elektronischen Modul mit einem aktiven Bauteil auf einem Substrat |
摘要 |
The electronic module manufacture method has an active component (1) mounted on a base (2). The upper module has an upper pad (P2) which is soldered to a contact pad on the base zone (Z2) by a solder material with a fusion temperature above that in the base zone. In manufacture the two zones are pushed together and heated to provide the assembly. |
申请公布号 |
DE60320513(D1) |
申请公布日期 |
2008.06.05 |
申请号 |
DE2003620513 |
申请日期 |
2003.11.10 |
申请人 |
ALCATEL LUCENT |
发明人 |
GIRAUDET, LOUIS |
分类号 |
H01L21/60;B23K31/02;H01L21/603;H01L31/02;H01S5/022;H05K3/32;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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