Halbleiterplatteschleifvorrichtung

摘要

In the wafer abrasive machine of the present invention, a gravity center and a rotational axis of a wafer (W) can be corresponded while abrading the wafer (W) and a holding plate (10) can be smoothly moved in a head member (24). The abrasive machine comprises: the head member (24) including a concave section (26), in which the holding plate (10) is accommodated; an elastic sheet member (38) suspending the holding plate (10), the elastic sheet member (38) being reinforced by a cloth-formed reinforcing member (41); a space (50) for storing pressure fluid which pushes the holding plate (10) toward the abrasive plate (20), the space (50) being formed between the elastic sheet member (38) and the concave section (26); and a plurality of spherical bodies (9) being provided between an outer face (10a) of the holding plate (10) and an inner face (24a) of the concave section (26), the spherical bodies (9) simultaneously point-contact the both circumferential faces (10a, 24a).