| 摘要 |
<P>PROBLEM TO BE SOLVED: To load logic circuit at low cost, as well as, at the chip scale of an image sensor chip in a wafer level package for image sensor. <P>SOLUTION: The wafer level package for image sensor is provided with an image sensor chip 1 for converting an incident light into an electrical signal, a thin-type circuit board 2, wherein a passive element is formed and a logic circuit chip 3 for processing signals. The thin-type circuit board 2 and the logic circuit chip 3 are electrically connected to each other, and the thin-type circuit board 2 is electrically connected to wiring layers 6A and 7A formed on the surface of the image sensor chip via a through hole TH1, formed in the image sensor chip 1 from the rear surface of the image sensor chip 1. <P>COPYRIGHT: (C)2008,JPO&INPIT |
