ELECTRONIC COMPONENT, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a reliable electronic component in a multilayered structure composed of a semiconductor substrate, and to provide a manufacturing method of the electronic component.

SOLUTION: The method of manufacturing an electronic component includes: a first process for forming a plurality of wiring boards in a structure where a conductive material is embedded into through holes penetrating through the semiconductor substrate; a second process for installing conductive projections on the conductive material of any of the plurality of wiring boards; and a third process for bonding the plurality of wiring boards and electrically connecting each conductive material of respective wiring boards by the projections.

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