发明名称 ELECTRONIC CIRCUIT APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic circuit apparatus wherein the heat generated from its heat-generating electronic component whose heat-radiating electrode has a positive potential is transferred to its housing for heat radiation to the air. <P>SOLUTION: In the electronic circuit apparatus, the heat generated from a diode 2 in which heat-radiating electrode 21 mounted on a surface 30A of a multilayer substrate 3 has a positive potential is transferred to a grounded conductor 31D of the surface 30A of the multilayer substrate 3 through an inner-layer heat conductor 32A of the inside of the multilayer substrate 3 and via 4, and is further transferred from the grounded conductor 31D to a cover 6 of its housing for heat radiation therefrom to the air. Thereby, the heat-generating electronic component need not be fastened to such heat-radiating means as a heat sink, and any short-circuit preventing means is not required. By the adoption of such easy means, the electronic circuit apparatus wherein the heat generated from its heat-generating electronic component with a heat-radiating electrode of positive potential is transferred effectively to its housing for heat radiation to the air can be realized. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008130684(A) 申请公布日期 2008.06.05
申请号 JP20060311969 申请日期 2006.11.17
申请人 DENSO CORP 发明人 MIYAGAKI SATOYUKI
分类号 H05K3/46;H01L23/34;H05K1/02;H05K7/20 主分类号 H05K3/46
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