发明名称 POLISHING COMPOSITION AND POLISHING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing composition which is capable of selectively polishing a silicon oxide film of a polysilicon film, and to provide a polishing method employing such a polishing composition. <P>SOLUTION: The polishing composition of the present invention comprises: abrasive grains selected from a silica and a ceria; an alkali selected from an ammonia, an ammonium salt, an alkali metal salt and an alkali metal hydroxide; and an organic modified silicone oil selected from a polyoxyethylene-modified silicone oil, a poly(oxyethyleneoxypropylene)-modified silicone oil, an epoxy/polyether-modified silicone oil and an amino/polyether-modified silicone oil. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008130988(A) 申请公布日期 2008.06.05
申请号 JP20060317380 申请日期 2006.11.24
申请人 FUJIMI INC 发明人 SHIMIZU MIKIKAZU;NAKAJIMA TAKEHIKO;ITO TAKASHI;HIRAMITSU AI
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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