发明名称 Storage node including diffusion barrier layer, phase change memory device having the same and methods of manufacturing the same
摘要 A phase change memory device and a method of manufacturing the phase change memory device are provided. The phase change memory device may include a switching element and a storage node connected to the switching element, wherein the storage node includes a bottom electrode and a top electrode, a phase change layer interposed between the bottom electrode and the top electrode, and a titanium-tellurium (Ti-Te)-based diffusion barrier layer interposed between the top electrode and the phase change layer. The Ti-Te based diffusion barrier layer may be a Ti<SUB>x</SUB>Te<SUB>1-x </SUB>layer wherein x may be greater than 0 and less than 0.5.
申请公布号 US2008128677(A1) 申请公布日期 2008.06.05
申请号 US20070984763 申请日期 2007.11.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK JONG-BONG;SHIN WOONG-CHUL;LEE JANG-HO
分类号 H01L45/00 主分类号 H01L45/00
代理机构 代理人
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