发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, AND FLEXIBLE PRINT CIRCUIT BOARD USING THE SAME |
摘要 |
<p>Disclosed is a photosensitive resin composition comprising components (A), (B) and (C), wherein the component (A) is an alkali-soluble resin, the component (B) is at least one compound selected from the group consisting of a compound having a structure represented by the formula (1), a compound having an isocyanurate ring and an imide compound having one or two imide groups which is different from the compound of the component (A), and the component (C) is a quinonediazide compound. P=X (1) wherein P represents a phosphorus atom, wherein the number of covalent bonds is 5; X represents a nitrogen atom or an oxygen atom, wherein the number of covalent bonds is 3 when X represents a nitrogen atom, the number of covalent bonds is 2 when X represents an oxygen atom, and the phosphorus atom and the nitrogen or oxygen atom are bound to each other via a double bond.</p> |
申请公布号 |
WO2008065905(A1) |
申请公布日期 |
2008.06.05 |
申请号 |
WO2007JP72222 |
申请日期 |
2007.11.15 |
申请人 |
ASAHI KASEI KABUSHIKI KAISHA;PI R & D CO., LTD.;SHIMIZU, TAKEKI;NAGASAWA, TOSHIAKI;TAKAHASHI, HIDEAKI;SOE, WIN MAW;GOSHIMA, TOSHIYUKI |
发明人 |
SHIMIZU, TAKEKI;NAGASAWA, TOSHIAKI;TAKAHASHI, HIDEAKI;SOE, WIN MAW;GOSHIMA, TOSHIYUKI |
分类号 |
G03F7/023;G03F7/004;H05K3/28 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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