| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a determiner, a determination method and an IC chip as their target to be determined, wherein the IC chip mounted on a substrate can be simply determined to be appropriate or not. <P>SOLUTION: The determiner is formed for determining a type of an IC chip 1 when the IC chip 1 provided with a plurality of bump contacts is mounted on an active matrix substrate 13 and the plurality of bump contacts are pressure-bonded to a metal wiring via an anisotropic conductive sheet. The determiner comprises: a memory 23 for storing information specifying each position, size and shape of the plurality of bump contacts for each type of IC chips; a photographer 20 for photographing a scar caused by the insulation displacement; and a determiner 21 for determining a type 1 of IC chip by a manner that each position, size and shape of the plurality of bump contacts of the IC chip 1 are specified from the photographed image, and the position, size and shape are compared with those specified from the information stored in the memory 23. <P>COPYRIGHT: (C)2008,JPO&INPIT |
